Chip Scale Package (CSP) LED Market To Reach USD 3.52 Billion By 2028 | CAGR of 16.5%

Chip Scale Package (CSP) LED
Chip Scale Package (CSP) LED

The manufacturing of CSP LEDs involves a low bill of materials, due to the removal of several packaging steps as compared to traditional LED packaging process, is a major factor driving the growth of the CSP LED market. Stiff competition in the LED packaging market has led to a strong consolidation within the market players in the development and launch of new and innovative CSP LEDs with improved designs and high-end specifications.

Market Size – USD 1.04 Billion in 2020, Market Growth – CAGR of 16.5% between 2020 and 2028, Market Trends –Low bill of materials due to removal of several packaging steps. 

The Chip Scale Package (CSP) LED market is estimated to be USD 1.04 Billion in 2020 and is likely to reach USD 3.52 Billion by 2026, at a CAGR of 16.5% between 2019 and 2026. The manufacturing of Chip Scale Package LEDs involves a low bill of materials, due to the removal of several packaging steps as compared to traditional LED packaging process, is a major factor driving the growth of the Chip Scale Package LED market. Stiff competition in the LED packaging market has led to a strong consolidation within the market players in the development and launch of new and innovative CSP LEDs with improved designs and high-end specifications.

Manufacturing process of traditional packaged LEDs usually undergo from the chip/die manufacturing to packaging processes where the dies are attached to an interposer or a ceramic substrate, which yields a packaged LED or more commonly known as an LED package. CSP LED, on the other hand eliminates the separate steps of having manufactured chips going through a packaging line. This is because, at the die-level itself, the chips are singulated and coated with phosphor. Solder pads or bond pads are attached at the wafer level immediately after the epitaxial stage of manufacturing with the help of semiconductor etching and metallization techniques. Chip Scale Package LEDs becomes installation ready on a PCB as soon as the wafer is diced. With the absence of a substrate and alloy/bonding wires to solder, CSP LEDs effectively streamlines the production processes, which results in reduction of the probability in making defective products. With several of the packaging steps removed as compared to a traditional LED package, the cost potential of a CSP LED is significantly reduced, with a low bill of materials.

The majority of LCD displays are produced in the APAC, especially by manufacturers in South Korea, Taiwan, China, and Japan; owing to which, this region registered the largest shipment of Chip Scale Package LEDs in the last 5 years. The market in APAC is expected to occupy a share of more than 85% in 2020. The lead reason for APAC region’s dominance is mainly due to countries such as South Korea, followed by China, Japan, and Taiwan which are generating high demand for CSP LEDs for applications such as in display backlighting, mobile flash, and others. CSP LEDs reduces the total number of LEDs required per backlighting panel along with the form factor of the backlighting unit (BLU) as compared to traditional LEDs while producing the same amount of Lumen output. The presence of leading CSP LED manufacturers as well as customers (i.e. wearable device vendors, smartphone vendors, backlighting panel integrators, and display panel manufacturers) in APAC is the primary reason for the dominance of the region in the market. The growth in this region is also driven by the rise of newer CSP LED applications for general lighting and automotive lighting applications. Increase in demand for these applications will be because of high economic growth in the region and focus of governments towards energy efficient lighting solutions.

Get sample PDF:  https://www.reportsanddata.com/download-free-sample/1397

Major players in the market are Seoul Semiconductor (South Korea), LG Innotek (South Korea), Lumileds (The Netherlands), Samsung (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).

Further key findings from the report suggest

  • The Chip Scale Package (CSP) LED market is estimated to be USD 1.04 Billion in 2020 and is likely to reach USD 3.52 Billion by 2026, at a CAGR of 16.5% between 2019 and 2026. The manufacturing of CSP LEDs involves a low bill of materials, due to the removal of several packaging steps as compared to traditional LED packaging process, is a major factor driving the growth of the Chip Scale Package LED market. Stiff competition in the LED packaging market has led to a strong consolidation within the market players in the development and launch of new and innovative CSP LEDs with improved designs and high-end specifications.
  • The steady adoption of CSP LEDs within the general lighting and automotive lighting segments will play an important role in the market growth during the forecast period. Demand for Chip Scale Package LEDs is expected to increase exponentially in the next 8 years due to the demand from these two segments which are offering growth opportunities to CSP LED manufacturers. The market for automotive lighting segment is expected to grow at the highest CAGR of 30% during the forecast period. Till now, the adoption of CSP LEDs in automotive segment is low, majority of which is in replaceable headlights, which are being supplied by local/regional vendors by utilizing CSP LEDs from manufacturers such as Seoul Semiconductor. Although the market size for CSP LEDs in the automotive lighting segment is very negligible, it is expected that demand for mid- and high-power CSP LEDs will increase exponentially 2019 onwards when automotive manufacturers and automotive lighting suppliers start adopting CSP LEDs for new installations.
  • High-power CSP LEDs are expected to lead the Chip Scale Package LED market during the forecast period, occupying a market share of 65% in 2020. Due to the steady growth in demand for CSP LEDs in automotive and general lighting during the forecast period, high-power CSP LEDs will find use in several applications such as automotive headlights, dash board panels, high bay lighting, street lighting, and architectural lighting.
  • The majority of LCD displays are produced in the APAC, especially by manufacturers in South Korea, Taiwan, China, and Japan; owing to which, this region registered the largest shipment of CSP LEDs in the last 5 years. The market in APAC is expected to occupy a share of more than 85% in 2020. The lead reason for APAC region’s dominance is mainly due to countries such as South Korea, followed by China, Japan, and Taiwan which are generating high demand for CSP LEDs for applications such as in display backlighting, mobile flash, and others. CSP LEDs reduces the total number of LEDs required per backlighting panel along with the form factor of the backlighting unit (BLU) as compared to traditional LEDs while producing the same amount of Lumen output. The presence of leading CSP LED manufacturers as well as customers (i.e. wearable device vendors, smartphone vendors, backlighting panel integrators, and display panel manufacturers) in APAC is the primary reason for the dominance of the region in the market. The growth in this region is also driven by the rise of newer CSP LED applications for general lighting and automotive lighting applications. Increase in demand for these applications will be because of high economic growth in the region and focus of governments towards energy efficient lighting solutions.

For the purpose of this report, the market has been segmented on the basis of application, power range, and region:

To identify the key trends in the industry, click on the link below:  https://www.reportsanddata.com/report-detail/chip-scale-package-csp-led-market 

  • Application Outlook (Revenue, USD Million; 2020–2028)
    • Backlighting Unit (BLU)
    • General Lighting
    • Automotive Lighting
    • Flash Lighting
    • Others
  • Power Range Outlook (Revenue, USD Million; 2020–2028)
    • Low- & Mid-Power
    • High-Power
  • Regional Outlook (Revenue, USD Million; 2020–2028)
    • North America
    • Europe
    • Asia Pacific

Request a customization of the report @ https://www.reportsanddata.com/request-customization-form/1397

Key questions addressed in the Report:

  • Which key factors are expected to hamper global market growth during the forecast period?
  • Which application segment revenue is expected to expand at a rapid CAGR between 2021 and 2028?
  • Which regional segment is expected to account for largest revenue share over the forecast period?

Thank you for reading the research report. Kindly note that we also offer customization of reports as per client requirement. Contact us to know more about the customization feature and our team will help you with the well-suited report as per your request.

About Reports and Data 

Reports and Data is a market research and consulting company that provides syndicated research reports, customized research reports, and consulting services. Our solutions purely focus on your purpose to locate, target, and analyze consumer behavior shifts across demographics, across industries, and help clients to make smarter business decisions. We offer market intelligence studies ensuring relevant and fact-based research across multiple industries, including Healthcare, Touch Points, Chemicals, Products, and Energy. We consistently update our research offerings to ensure our clients are aware of the latest trends existent in the market. Reports and Data has a strong base of experienced analysts from varied areas of expertise. Our industry experience and ability to develop a concrete solution to any research problems provides our clients with the ability to secure an edge over their respective competitors.

Contact:

John W, Head of Business Development
Reports And Data | Web: www.reportsanddata.com
Direct Line: +1-212-710-1370
E-mail: [email protected]
LinkedIn | Twitter | Blogs

image credit

You may also like...

Leave a Reply

Your email address will not be published. Required fields are marked *