Intelligent Power Module Market Competitive Landscape, Research Methodology, Business Opportunities, Statistics and Industry Analysis Report by 2028
The new report titled ‘Global Intelligent Power Module Market’, published by Emergen Research, is methodically curated by our team of analysts, keeping readers’ understanding in mind, and includes a wide-ranging database of industry distribution. This steady increase in revenue might be linked to the growing use and global research and development of electric and hybrid automobiles. Another important driver in the market’s expansion is the focus of the world’s main economies on modernising their electricity infrastructure. Additionally, growing government investment in tidal, wind, and solar projects fuels industry expansion. Electronic gadgets and equipment are necessary for the creation of several new industries as well as the extension of those that already exist. This significantly advances the market’s growth.
Researchers have taken a holistic approach towards the global market analysis and highlighted the factors that influence the overall growth of the market. The study involves the use of efficient analytical tools like SWOT analysis and Porter’s Five Forces to inspect the strengths, weaknesses, opportunities, and threats associated with the growth of the various market segments. The report provides crucial details, such as the market shares of the key players, which help the reader attain a comprehensive outlook of the Intelligent Power Module market.
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The global Intelligent Power Module market is highly consolidated due to the presence of a large number of companies across this industry. These companies are known to make hefty investments in research and development projects. Also, they control a considerable portion of the overall market share, thus limiting the entry of new players into the sector.
Some of the key participants in this industry include:
- Mitsubishi Electric Corporation,
- STMicroelectronics NV,
- ROHM Semiconductors,
- Sanken Electric Co. Ltd,
- Texas Instruments Incorporated,
- ON Semiconductor,
- Fuji Electric Co. Ltd,
- Hon Hai Precision Industry Co., Ltd,
- Infineon Technologies,
- Central Semiconductor
Key Highlights of Report
- In December 2020, the 1200V transfer molded silicon carbide (SIC) integrated power module was launched by Infineon Technologies AG. This has application in industrial motor drives and pump drives.
- In April 2018, ACEPACK1 and ACEPACK 2 was launched by STMicroelectronics NV. These products were launched for the application in welding tools, solar panels and power management solutions.
- In May 2017, CIPOS IPM was launched by Infineon Technologies AG. This provides a single switch boost by combining power factor correction and a 3-phase inverter.
Key regions covered in the report:
- North America
- Asia Pacific
- Latin America
- Middle East & Africa
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Asia Pacific is expected to account for the largest revenue share during the forecast period. This growth can be attributed to the presense of major key players in the region.
For this report, Emergen Research has segmented the global intelligent power module market based on voltage rating, current rating, power devices, application and region.
- Voltage Rating Outlook (Revenue, USD Billion; 2021–2028)
- Up To 600V
- 601 V – 1200 V
- Above 1200V
- Current Rating Outlook (Revenue, USD Billion; 2021–2028)
- Up To 100 A
- 101 A – 600 A
- Above 600 A
- Power Devices Outlook (Revenue, USD Billion; 2021–2028)
- Application Outlook (Revenue, USD Billion; 2021–2028)
- Consumer Electronics
- Aerospace & Defense
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