Radiation Hardened Electronics Market Drivers, Restraints, Merger, Acquisition, SWOT Analysis, PESTELE Analysis and Business Opportunities by 2030
According to the most recent Emergen Research analysis, the global Radiation Hardened Electronics (RHE) market was worth USD 1.48 billion in 2021 and is expected to grow at a 3.9% CAGR during the forecast period. Rising demand for low-cost nanosatellites and communication satellites, as well as increased intelligence, surveillance, and reconnaissance operations as nations become more hostile, will drive market revenue growth between 2022 and 2030. The growing number of commercial space operations has resulted in an increase in demand for radiation-hardened power management systems.
COVID-19 has had a significant impact on the value chain and demand for radiation-hardened electronics across a wide range of end-use industries. COVID-19 has a significant impact on satellite manufacturing as an application of radiation-hardened electronic components. This market is distinguished by low production volumes and a high level of specialisation, as well as a small number of suppliers. COVID-19 has also caused supply chain disruptions, longer lead times in raw material and component supplies, delays in contract executions, and lockdowns in various countries, particularly in the European region, where a third phase of lockdown occurred during the first quarter of 2021. Some of the industry’s manufacturing activities are also performed by back-end subcontractors and external silicon foundries.
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Some Key Highlights From the Report
Over the forecast period, the aerospace and defence segment is expected to grow at a significantly faster rate. This is due to the increasing use of small satellites equipped with radiation-hardened electronics for defence purposes, which is expected to drive segment growth.
Because of rising demand for spacecraft electronics and government implementation of nuclear power plant testing regulations, the North America market is expected to grow at a significantly faster rate over the forecast period.
Micropac Industries Inc., BAE Systems Plc., Honeywell International Inc., ST Microelectronics N.V., Microchip Technology Inc., Solitron Devices Inc., Cobham Limited, pSemi Corporation, Infineon Technologies AG, and Renesas Electronics Corporation are among the major companies mentioned in the market report.
Microchip Technology Inc. announced plans to expand its radiation-hardened arm microcontroller for space systems in April 2021. This system will provide single-core processor simplicity, advanced performance, and radiation hardening of space equipment without the use of heavy mitigation techniques.
Emergen Research has segmented the global radiation hardened electronics market based on manufacturing technique, product type, component type, application, and region:
- Manufacturing Technique Outlook (Revenue, USD Billion; 2019-2030)
- Rad-hard By Process
- Rad-hard By Design
- Rad-hard By Software
- Product Type Outlook (Revenue, USD Billion; 2019-2030)
- Commercial-off-the-shelf (COTS)
- Custom Made
- Component Type Outlook (Revenue, USD Billion; 2019-2030)
- Controllers & Processors
- Analog & Digital Mixed Signal Devices
- Power management
- Application Outlook (Revenue, USD Billion; 2019-2030)
- Aerospace & Defense
- Nuclear Power Plant
- Regional Outlook (Revenue, USD Billion; 2019-2030)
- North America
- Rest of Europe
- Asia Pacific
- South Korea
- Rest of APAC
- Latin America
- Rest of LATAM
- Middle East & Africa
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
- North America
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